Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

Renewable-energy applications, as well as all kinds of energy-efficiency technologies, require reliable, compact, and thermal-efficient power devices. For driving innovation in wind turbines, smart ...

Abstract: Process design kits (PDKs) are well-known catalysts in integrated circuit (IC) design. However, they are still a new concept to the packaging world and many packaging engineers do not ...