Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D ...

Key market opportunities include rising demand for AI chips, IoT expansion driving microchip use, and growth in advanced manufacturing technologies such as 3D/2.5D packaging. Regional increases in ...

FPT officially enters the chip race with Vietnam’s first advanced semiconductor packaging and testing plant, following ...

Demand for advanced electronics, increased functionality, and compact designs is significantly accelerating the adoption of three-dimensional （3D） semiconductor packaging solutions. This packaging ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

As the global semiconductor industry pushes forward with advanced processes, heterogeneous integration, and cutting-edge ...

In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...

As advanced chipmaking takes root in Arizona, the state is proving that building a world-class industry is a collective effort ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's ...